| PART |
Description |
Maker |
| CYM1828HG-25C |
32K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 1.100 X 1.100 INCH, HERMETIC SEALED, PGA-66
|
Intersil, Corp.
|
| MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7881 |
GaAs MULTI-CHIP MODULE
|
NEC
|
| MC-7832-HA MC-7832-HA-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| FDMF6700 |
Driver plus FET Multi-chip Module
|
Fairchild Semiconductor
|
| AT68166H-YM20-E AT68166H-YM20-SCC AT68166H-YM20MQ |
Rad Hard 16 MegaBit 3.3V SRAM Multi-Chip Module
|
ATMEL Corporation
|
| AK49064SP-10 AK44064SP-10 AK44256SN-12 AK411024SRM |
64K X 9 MULTI DEVICE DRAM MODULE, 100 ns, SMA30
64K X 4 MULTI DEVICE DRAM MODULE, 100 ns, SMA22
256K X 4 MULTI DEVICE DRAM MODULE, 120 ns, SMA22
1M X 1 MULTI DEVICE DRAM MODULE, 150 ns, SMA22
128K X 1 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
64K X 2 MULTI DEVICE DRAM MODULE, 150 ns, CDIP18
|
|
| WEDPNF8M721V-XBX WEDPNF8M721V-1010BC WEDPNF8M721V- |
8Mx72 Synchronous DRAM 8Mb Flash Mixed Module Multi-Chip Package 8Mx72同步DRAM 8MB闪存的混合模块多芯片封装
|
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
|
| SKY77602 |
Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch
|
Skyworks Solutions Inc.
|
|
